Assignment of Assignor's Interest

Recorded: 2009-01-15 Pages: 3

Assignor

SHIBUYA, HIROKI

Executed: 2009-01-08

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor package, and method of manufacturing semiconductor package

Application: 12/320,050 →

Publication: US 2009/0201656

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.