Patent Assignment
Reel/Frame 022179/0003
Assignment of Assignor's Interest
Recorded: 2009-01-15
Pages: 3
Assignors
KIM, HO-KYUNG
Executed: 2009-01-09
LEE, SEUNG-YONG
Executed: 2009-01-14
LEE, JONG-SEOK
Executed: 2009-01-14
CHOE, SUNG-YUL
Executed: 2009-01-09
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
POSTECH ACADEMY-INDUSTRY FOUNDATION
SAN 31, HYOJA-DONG, NAM-GU, POHANG-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method, Medium, and System for Compressing and Decoding Mesh Data in Three-Dimensional Mesh Model