Patent Assignment
Reel/Frame 022187/0133
Assignment of Assignor's Interest
Recorded: 2009-02-02
Pages: 2
Assignor
KAWABATA, TAKESHI
Executed: 2008-11-17
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Substrate for Wiring, Semiconductor Device for Stacking Using the Same, and Stacked Semiconductor Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.