Patent Assignment
Reel/Frame 022194/0824
Assignment of Assignor's Interest
Recorded: 2009-02-03
Pages: 6
Assignors
YUN, JONG HO
Executed: 2009-01-15
LEE, JONG MYEONG
Executed: 2009-01-15
CHOI, GIL HEYUN
Executed: 2009-01-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Interlayer Dielectrics Having Air Gaps