Patent Assignment
Reel/Frame 022197/0161
Assignment of Assignor's Interest
Recorded: 2009-02-03
Pages: 2
Assignor
ISHIZAKA, TADAHIRO
Executed: 2009-02-02
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device with Metal-Containing Cap Layers