IP Library › Assignment 022199/0679
Patent Assignment
Reel/Frame 022199/0679

Assignment of Assignor's Interest

Recorded: 2009-02-03 Pages: 2
Assignors
NAKASHIMA, SEIYO
Executed: 2009-01-21
YAMADA, TOMOYUKI
Executed: 2009-01-21
SHIMADA, MASAKAZU
Executed: 2009-01-21
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1 SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device, and Process Tube
Patent: 8,303,712 →
Application: 12/363,045 →
Publication: US 2009/0197402
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →