Patent Assignment
Reel/Frame 022220/0153
Assignment of Assignor's Interest
Recorded: 2009-01-22
Pages: 3
Assignors
PARK, SEUNG WOOK
Executed: 2008-11-28
KWEON, YOUNG DO
Executed: 2008-11-28
YUAN, JINGLI
Executed: 2008-11-28
MOON, SEON HEE
Executed: 2008-11-28
HONG, JU PYO
Executed: 2008-12-01
LEE, JAE KWANG
Executed: 2008-11-28
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Dual Face Package Having Resin Insulating Layer