Patent Assignment
Reel/Frame 022227/0677
Assignment of Assignor's Interest
Recorded: 2009-02-09
Pages: 4
Assignors
KO, WOO-SEOK
Executed: 2009-01-28
YANG, YU-SIN
Executed: 2009-01-28
YOON, YOUNG-JEE
Executed: 2009-01-28
JUN, CHUNG-SAM
Executed: 2009-01-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Inspecting a Surface of a Wafer