Patent Assignment
Reel/Frame 022229/0499
Assignment of Assignor's Interest
Recorded: 2009-02-06
Pages: 3
Assignors
LEE, WOO-JIN
Executed: 2009-01-26
SHIMIZU, AKIRA
Executed: 2009-01-26
FUKAZAWA, ATSUKI
Executed: 2009-01-26
Assignee
ASM JAPAN K.K.
23-1, 6 CHOME, NAGAYAMA, TAMA-SHI, TOKYO, 206-0025, JAPAN
Covered Property
(1)
Method of Forming Conformal Dielectric Film Having Si-N Bonds by Pecvd