IP Library › Assignment 022245/0244
Patent Assignment
Reel/Frame 022245/0244

Assignment of Assignor's Interest

Recorded: 2009-02-11 Pages: 2
Assignors
LIN, CHUAN-YI
Executed: 2008-11-19
LEE, SONG-BOR
Executed: 2008-11-19
HUANG, CHING-KUN
Executed: 2008-11-19
LIN, SHENG-YUAN
Executed: 2008-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Method of Forming Through-Silicon Vias
Patent: 7,825,024 →
Application: 12/277,829 →
Publication: US 2010/0130003
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 15, 2025
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: MAGO BARCA IP LLC
Reel/Frame 070847/0983 →