Patent Assignment
Reel/Frame 070847/0983
Assignment of Assignor's Interest
Recorded: 2025-04-15
Pages: 9
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Executed: 2025-03-28
Assignee
MAGO BARCA IP LLC
8105 RASOR BLVD. STE 210, PLANO, TEXAS, 75024
Covered Properties
(32)
Method for Stacking Devices
Method of Forming Through-Silicon Vias
Stacked Integrated Chips and Methods of Fabrication Thereof
Through-Silicon via Formed with a Post Passivation Interconnect Structure
Semiconductor Device Having Multi-Thickness Gate Dielectric
Package Systems Having Interposers
Multi-Die Stacking Using Bumps with Different Sizes
Three-Dimensional Integrated Circuit Structure Having Improved Power and Thermal Management
Through-Silicon via Formed with a Post Passivation Interconnect Structure
Through Silicon via (Tsv) Isolation Structures for Noise Reduction in 3D Integrated Circuit
Finfet Body Contact and Method of Making Same
Apparatus and Method for Forming Semiconductor Contacts
Metal Pad Structure Over Tsv to Reduce Shorting of Upper Metal Layer
Multi-Die Stacking Using Bumps with Different Sizes
Stacked Integrated Chips and Methods of Fabrication Thereof
Through Silicon via (Tsv) Isolation Structures for Noise Reduction in 3D Integrated Circuit
Contact Structure and Formation Thereof
FinFET Body Contact and Method of Making Same
Apparatus and Method for Forming Semiconductor Contacts
Stacked Semiconductor Devices and Methods of Forming Same
FinFET Body Contact and Method of Making Same
Method of Manufacturing Package System
Metal Pad Structure Over TSV to Reduce Shorting of Upper Metal Layer
Apparatus and Method for Forming Semiconductor Contacts
Contact Structure and Formation Thereof
Methods of Forming Metal Pad Structures Over TSVS to Reduce Shorting of Upper Metal Layers
Package System for Integrated Circuits
Contact Structure and Formation Thereof
Source/Drain Contact Spacers and Methods of Forming Same
Package System for Integrated Circuits
Contact Structure and Formation Thereof
Source/Drain Contact Spacers and Methods of Forming Same
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 8, 2008
From: WANG, DEAN; LEE, CHIEN-HSIUN; CHEN, CHEN-SHIEN; CHAO, CLINTON
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021208/0208 →
Assignment of Assignor's Interest
Feb 11, 2009
From: LIN, CHUAN-YI; LEE, SONG-BOR; HUANG, CHING-KUN; LIN, SHENG-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 022245/0244 →
Assignment of Assignor's Interest
Nov 9, 2009
From: CHEN, MING-FA; HUANG, JAO SHENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 023487/0907 →
Assignment of Assignor's Interest
Jan 8, 2010
From: TSENG, MING-HONG; JAO, SHENG HUANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 023754/0781 →
Assignment of Assignor's Interest
Mar 10, 2010
From: CHOU, HSUEH-LIANG; LIU, RUEY-HSIN; YAO, CHIH-WEN; TUAN, HSIAO-CHIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
Reel/Frame 024059/0584 →
Assignment of Assignor's Interest
May 26, 2010
From: WU, WEI-CHENG; HOU, SHANG-YUN; JENG, SHI-PUU; YU, CHEN-HUA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024442/0869 →
Assignment of Assignor's Interest
Jul 22, 2010
From: WU, WENG-JIN; SHIH, YING-CHING; CHIOU, WEN-CHIH; JENG, SHIN-PUU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024729/0165 →
Assignment of Assignor's Interest
Jul 29, 2010
From: LAW, OSCAR M. K.; WU, KUO H.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024762/0151 →
Assignment of Assignor's Interest
Mar 21, 2011
From: TSENG, MING-HONG; JAO, SHENG HUANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025988/0232 →
Assignment of Assignor's Interest
Jan 9, 2012
From: HORNG, JAW-JUINN; YU, CHIA-LIN; CHEN, CHUNG-HUI; YEH, DER-CHYANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 027499/0728 →
Assignment of Assignor's Interest
Apr 22, 2012
From: LO, CHING-HSIUNG; LEE, JAM-WEM; LIN, WUN-JIE; TSENG, JEN-CHOU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 028085/0850 →
Assignment of Assignor's Interest
Oct 24, 2012
From: COLINGE, JEAN-PIERRE
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 029186/0582 →
Assignment of Assignor's Interest
Jan 8, 2013
From: TSENG, CHUNG-CHUAN; LIU, CHIA-WEI; KUO, CINDY; XIAO, REN-WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 029589/0235 →
Assignment of Assignor's Interest
Nov 27, 2013
From: LEE, HONG-MAO; TSAI, TENG-CHUN; WANG, LI-TING; CHEN, CHI-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 031684/0488 →