Patent Assignment
Reel/Frame 027499/0728
Assignment of Assignor's Interest
Recorded: 2012-01-09
Pages: 8
Assignors
HORNG, JAW-JUINN
Executed: 2011-12-06
YU, CHIA-LIN
Executed: 2011-12-06
CHEN, CHUNG-HUI
Executed: 2011-12-06
YEH, DER-CHYANG
Executed: 2011-12-23
PENG, YUNG-CHOW
Executed: 2011-12-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Through Silicon via (Tsv) Isolation Structures for Noise Reduction in 3D Integrated Circuit
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.