Patent Assignment
Reel/Frame 029589/0235
Assignment of Assignor's Interest
Recorded: 2013-01-08
Pages: 2
Assignors
TSENG, CHUNG-CHUAN
Executed: 2012-11-15
LIU, CHIA-WEI
Executed: 2012-11-15
KUO, CINDY
Executed: 2012-11-15
XIAO, REN-WEI
Executed: 2012-11-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Metal Pad Structure Over Tsv to Reduce Shorting of Upper Metal Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.