Patent Assignment
Reel/Frame 023754/0781
Assignment of Assignor's Interest
Recorded: 2010-01-08
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Through-Silicon via Formed with a Post Passivation Interconnect Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.