IP Library › Assignment 024729/0165
Patent Assignment
Reel/Frame 024729/0165

Assignment of Assignor's Interest

Recorded: 2010-07-22 Pages: 4
Assignors
WU, WENG-JIN
Executed: 2010-06-28
SHIH, YING-CHING
Executed: 2010-06-28
CHIOU, WEN-CHIH
Executed: 2010-06-28
JENG, SHIN-PUU
Executed: 2010-06-28
YU, CHEN-HUA
Executed: 2010-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Multi-Die Stacking Using Bumps with Different Sizes
Patent: 8,581,418 →
Application: 12/840,949 →
Publication: US 2012/0018876
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 15, 2025
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: MAGO BARCA IP LLC
Reel/Frame 070847/0983 →