Patent Assignment
Reel/Frame 024762/0151
Assignment of Assignor's Interest
Recorded: 2010-07-29
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit Structure Having Improved Power and Thermal Management
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.