Patent Assignment
Reel/Frame 025988/0232
Assignment of Assignor's Interest
Recorded: 2011-03-21
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Through-Silicon via Formed with a Post Passivation Interconnect Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.