Patent Assignment
Reel/Frame 022246/0275
Assignment of Assignor's Interest
Recorded: 2009-02-12
Pages: 4
Assignors
HATTORI, KAZUO
Executed: 2009-02-06
FUJIMOTO, ISAMU
Executed: 2009-02-06
KUROIWA, SHINICHIRO
Executed: 2009-02-06
NODA, SATORU
Executed: 2009-02-06
Assignee
MURATA MANUFACTURING CO., LTD.
10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Component-Embedded Substrate and Component Package Using Component-Embedded Substrate