IP Library › Assignment 022260/0193
Patent Assignment
Reel/Frame 022260/0193

Assignment of Assignor's Interest

Recorded: 2009-02-16 Pages: 18
Assignors
CASEY, JON A
Executed: 2008-12-23
CORBIN, JOHN S, JR.
Executed: 2008-12-19
DANOVITCH, DAVID
Executed: 2008-12-18
DEPATIE, ISABELLE
Executed: 2008-12-19
JADHAV, VIRENDRA R
Executed: 2009-01-02
LIPTAK, ROGER A
Executed: 2008-12-18
MARSTON, KENNETH C
Executed: 2008-12-30
MUNCY, JENNIFER V
Executed: 2008-12-18
OUIMET, SYLVAIN
Executed: 2008-12-18
SALVAS, ERIC
Executed: 2008-12-19
Assignee
IBM CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Achieving Mechanical and Thermal Stability in a Multi-Chip Package
Patent: 8,202,765 →
Application: 12/357,716 →
Publication: US 2010/0181665
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 22260 Frame: 193. Assignor(S) Hereby Confirms the Assignment. Dec 4, 2019
From: CASEY, JON A.; CORBIN, JOHN S., JR.; DANOVITCH, DAVID; DEPATIE, ISABELLE
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 051195/0399 →