IP Library Assignment 022267/0309
Patent Assignment
Reel/Frame 022267/0309

Assignment of Assignor's Interest

Recorded: 2009-02-17 Pages: 2
Assignors
INAMOTO, YOSHIMASA
Executed: 2008-03-21
NAKATSUJI, HACHIRO
Executed: 2008-03-24
INOUE, KAZUHIRO
Executed: 2008-03-21
TSUJI, HIROYUKI
Executed: 2008-03-21
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Electrode Bonding Method and Part Mounting Apparatus
Patent: 8,449,712 →
Application: 12/300,546 →
Publication: US 2009/0145546
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 6, 2009
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 022363/0306 →