Electrode bonding method and part mounting apparatus
View Patent ↗An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.
1. An electrode bonding method comprising:
a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part and a substrate with atmospheric pressure plasma for cleaning;
an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter;
and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended,
wherein, in the plasma cleaning step, the electrode surface is cleaned by a second atmospheric pressure plasma generated by making a mixed gas of a third inert gas and a reactive gas collide with a first atmospheric pressure plasma generated by applying a high frequency electric field to a second inert gas.
2. The electrode bonding method according to claim 1 , wherein, in the irradiating, ion charges are removed from the plasma by using a ground electrode arranged near the irradiating atmospheric pressure gas plasma, so that the irradiation primarily involves radicals alone.
3. The electrode bonding method according to claim 1 , wherein, in the irradiating, the electrode surface to be cleaned and its vicinity are covered with the first inert gas before being irradiated with the atmospheric pressure gas plasma, so that the electrode surface to be cleaned is irradiated with radicals in the atmospheric pressure gas plasma through the medium of the first inert gas.
4. The electrode bonding method according to claim 1 , wherein, in the covering, the first inert gas is supplied so as to flow along the electrode surface to be cleaned, and the first inert gas is sucked after it has flown along the electrode surface to be cleaned.