IP Library › Assignment 022282/0162
Patent Assignment
Reel/Frame 022282/0162

Assignment of Assignor's Interest

Recorded: 2009-02-19 Pages: 5
Assignors
FJELSTAD, JOSEPH C., MR.
Executed: 2009-02-19
GRUNDY, KEVIN P., MR.
Executed: 2009-02-18
Assignee
INTERCONNECT PORTFOLIO LLC
20400 STEVENS CREEK BLVD., 5TH FLOOR, I. P. LEGAL, CUPERTINO, CALIFORNIA, 95014
Covered Property (1)
Controlled Impedance Structures for High Density Interconnections
Patent: 8,026,600 →
Application: 12/348,273 →
Publication: US 2009/0167334
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
License Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →