Patent Assignment
Reel/Frame 022283/0767
Assignment of Assignor's Interest
Recorded: 2009-02-09
Pages: 3
Assignors
LEE, TEAK-HOON
Executed: 2009-01-19
KIM, PYOUNG-WAN
Executed: 2009-01-19
KIM, NAM-SEOG
Executed: 2009-01-19
JANG, CHUL-YONG
Executed: 2009-01-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Fabricating the Same