Patent Assignment
Reel/Frame 022293/0913
Assignment of Assignor's Interest
Recorded: 2009-02-23
Pages: 9
Assignors
BELANGER, LUC L
Executed: 2008-12-09
BERGENDAHL, MARC A
Executed: 2008-12-11
GIRI, AJAY P
Executed: 2009-01-19
LAURO, PAUL A
Executed: 2008-12-08
OBERSON, VALERIE A
Executed: 2008-12-09
SHIH, DA-YUAN
Executed: 2008-12-08
Assignee
IBM CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Novel Structure of Ubm and Solder Bumps and Methods of Fabrication
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.