Patent Assignment
Reel/Frame 022297/0845
Assignment of Assignor's Interest
Recorded: 2009-02-10
Pages: 2
Assignee
UTAC THAI LIMITED
237 LASSALLE ROAD, BANGUA, BANGKOK 10260, THAILAND
Covered Property
(1)
Molded Leadframe Substrate Semiconductor Package
Patent:
9,196,470 →
Application:
12/378,119 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.