IP Library Assignment 022304/0167
Patent Assignment
Reel/Frame 022304/0167

Assignment of Assignor's Interest

Recorded: 2009-02-24 Pages: 3
Assignor
SASE, HIROYUKI
Executed: 2009-02-19
Assignee
HONDA MOTOR CO., LTD.
1-1, MINAMI-AOYAMA 2-CHOME, MINATO-KU, TOKYO, 107-8556, JAPAN
Covered Property (1)
Installation Structure of Resin Garnish
Patent: 7,954,885 →
Application: 12/391,676 →
Publication: US 2009/0218850