Patent Assignment
Reel/Frame 022304/0996
Assignment of Assignor's Interest
Recorded: 2009-02-12
Pages: 2
Assignors
SUZUKI, NAOHIRO
Executed: 2009-02-04
OKUNO, EIICHI
Executed: 2009-02-04
MATSUKI, HIDEO
Executed: 2009-02-04
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Silicon Carbide Semiconductor Device Including Deep Layer