Patent Assignment
Reel/Frame 022314/0530
Assignment of Assignor's Interest
Recorded: 2009-02-26
Pages: 8
Assignors
LEE, HO JIN
Executed: 2009-01-19
JANG, DONG HYEON
Executed: 2009-01-19
KIM, NAM SEOG
Executed: 2009-01-19
LEE, IN YOUNG
Executed: 2009-01-19
YIM, HA YOUNG
Executed: 2009-01-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Microelectronic Devices Including Multiple Through-Silicon via Structures on a Conductive Pad and Methods of Fabricating the Same