IP Library › Assignment 022319/0397
Patent Assignment
Reel/Frame 022319/0397

Assignment of Assignor's Interest

Recorded: 2009-02-17 Pages: 4
Assignors
YEO, ALFRED
Executed: 2009-02-17
CHAN, KAI CHONG
Executed: 2009-02-17
Assignee
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Fabricating Method for Crack Stop Structure Enhancement of Integrated Circuit Seal Ring
Patent: 8,048,761 →
Application: 12/378,513 →
Publication: US 2010/0207237
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 2, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 024476/0268 →
Change of Name Jun 2, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 024476/0275 →
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →