Patent Assignment
Reel/Frame 022323/0391
Assignment of Assignor's Interest
Recorded: 2009-02-19
Pages: 3
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Tape Wiring Substrate and Semiconductor Chip Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.