Patent Assignment
Reel/Frame 022323/0971
Assignment of Assignor's Interest
Recorded: 2009-02-27
Pages: 2
Assignor
ABE, MASAAKI
Executed: 2009-02-12
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method for Printing a Metal Paste, Metal Mask, and Bump Forming Method
Application:
12/394,595 →
Publication:
US 2009/0239091
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.