Patent Assignment
Reel/Frame 025193/0183
Change of Name
Recorded: 2010-10-26
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Method of Manufacturing Semiconductor Device for Providing Improved Isolation Between Contact and Cell Gate Electrode
Lead cutter and method of cutting lead
Application:
12/382,726 →
Publication:
US 2009/0255389
Semiconductor Integrated Circuit
Splitter Circuit
Semiconductor integrated circuit
Application:
12/382,814 →
Publication:
US 2009/0243119
Driving Circuit for Display Device, and Test Circuit and Test Method for Driving Circuits
Signal Output Circuit
Synchronization detecting method and synchronization detecting circuit
Application:
12/382,854 →
Publication:
US 2009/0268577
Semiconductor Memory Device
Output Amplifier Circuit and Data Driver of Display Device Using the Same
Semiconductor Device with Transistors and Its Manufacturing Method
Apparatus and method for generating power supply noise model
Application:
12/385,209 →
Publication:
US 2009/0228260
Semiconductor memory device and manufacturing method therefor
Voltage-Controlled Oscillator Including Plurality of Delay Cells
Semiconductor Device
Communication Apparatus
Semiconductor Device and Timing Adjusting Method for Semiconductor Device
Semiconductor Integrated Circuit Including Plurality of Bonding Pads
Temperature Sensor Circuit with Reference Voltage That Exhibits the Same Nonlinear Temperature Response as the Temperature Sensor
Semiconductor Device Including Offset Bonding Pad and Inspection Method Therefor
Method of Predicting Reliability of Semiconductor Device, Reliability Prediction System Using the Same and Storage Medium Storing Program Causing Computer to Execute the Same
Noise Removal Device and Noise Removal Method
Radio Communication Apparatus
Semiconductor Device Having a Lower-Layer Line
Semiconductor Device and Method of Manufacturing the Same
Signal Processing Device Having a Variable Current Source
Fuse Data Read Circuit Having Control Circuit Between Fuse and Current Mirror Circuit
Method of Manufacturing Semiconductor Device, and Etching Apparatus
Semiconductor Device Design Support Apparatus and Semiconductor Device Design Support Method
Semiconductor Chip and Semiconductor Device, and Method of Manufacturing the Same
Differential Amplifier Circuit Having Offset Adjustment Circuit
Semiconductor Device and Method of Fabricating the Same
Position Aligning Apparatus, Position Aligning Method, and Semiconductor Device Manufacturing Method
Mobile terminal and indoor/outdoor judgment method
Application:
12/385,992 →
Publication:
US 2009/0291641
Circuit analysis method, semiconductor integrated circuit manufacturing method, circuit analysis program and circuit analyzer
Application:
12/385,993 →
Publication:
US 2009/0276746
Electronic device and method of manufacturing the same
Application:
12/385,994 →
Publication:
US 2009/0288852
Semiconductor device
Application:
12/385,996 →
Publication:
US 2009/0323236
Fsk Receiver
Optical Receptacle and Optical Receptacle Module
Semiconductor Device Having a Refractory Metal Containing Film and Method for Manufacturing the Same
Solid-State Image Sensing Apparatus and Package of Same
Semiconductor Device Manufacturing Method
Solid-State Imaging Device and Method of Driving the Same
Semiconductor Integrated Circuit and Condenser Microphone
Motion-Compensating Device with Booth Multiplier That Reduces Power Consumption Without Increasing the Circuit Size
Method for Printing a Metal Paste, Metal Mask, and Bump Forming Method
Application:
12/394,595 →
Publication:
US 2009/0239091
Reflective Mask Blank, Reflective Mask, Method of Inspecting Reflective Mask, and Method for Manufacturing the Same
Usb Controller and Buffer Memory Control Method
Apparatus and Method for Decision Feedback Equalization
Sample-And-Hold Circuit and Ccd Image Sensor
Substrate Processing Method and Substrate Processing Apparatus
Application:
12/409,855 →
Publication:
US 2009/0236316
Communication Device and Method of Correcting the Same
Solid-State Imaging Device
Protection Circuit
Semiconductor Memory Device
Method for Manufacturing a Semiconductor Device
Patent:
8,062,961 →
Application:
12/414,011 →
Signal Processing Device
Plating Method, Semiconductor Device Manufacturing Method and Plate Processing System
Application:
12/414,215 →
Publication:
US 2009/0242409
Semiconductor Integrated Circuit and Layout Method for the Same
Application:
12/416,492 →
Publication:
US 2009/0243121
Semiconductor Memory and Method for Manufacturing the Same
Electrical Surge Protective Apparatus
Application:
12/418,041 →
Publication:
US 2009/0250721
Semiconductor Memory Device
Semiconductor Memory Device and System Using Semiconductor Memory Device
Application:
12/420,204 →
Publication:
US 2009/0254784
Communication Apparatus
Application:
12/420,246 →
Publication:
US 2009/0257522
Semiconductor Memory Device
Start Signal Detection Circuit
Semiconductor Device and Method of Manufacturing the Same
Visual Inspection Method and Visual Inspection Apparatus
Method and Apparatus for Data Stream Analysis and Decoding Apparatus
Application:
12/424,991 →
Publication:
US 2009/0265478
Information Processing System and Task Execution Control Method
Application:
12/425,112 →
Publication:
US 2009/0271796
Image Processing Apparatus
Application:
12/425,652 →
Publication:
US 2009/0268253
Level Shift Circuit
Semiconductor Device Having an Annular Guard Ring
Semiconductor Device and Method for Manufacturing the Same
Amplifier Circuit
Semiconductor Device and Method of Manufacturing Same
Application:
12/428,686 →
Publication:
US 2009/0267142
Method of Manufacturing Semiconductor Device
Semiconductor Device
Semiconductor Device
Application:
12/429,581 →
Publication:
US 2009/0271140
Error Detection Method and Circuit, and Error Reduction Method and Circuit
Identification Information Management System and Method for Microcomputer
Application:
12/430,549 →
Publication:
US 2009/0292864
Device Comprising Electrode Pad
Semiconductor Device Including Vanadium Oxide Sensor Element with Restricted Current Density
Application:
12/432,102 →
Publication:
US 2009/0212385
Electronic Device Substrate and Its Fabrication Method, and Electronic Device and Its Fabrication Method
Low Noise Receiving Apparatus
Semiconductor Device, Method for Manufacturing Semiconductor Device, and Power Amplifier Element
Wireless Communication Apparatus and a Reception Method Involving Frequency Hopping
Semiconductor Memory Device and Data Input/Output Method Thereof
Application:
12/436,483 →
Publication:
US 2009/0287888
Wireless Communication Device and Method of Displaying Wireless Communication State
Application:
12/436,555 →
Publication:
US 2009/0290628
Pulse Detection Device and Pulse Detection Method
Electronic Device and Method of Manufacturing the Electronic Device
Amplifier and Offset Regulating Circuit
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2009
From: KUROKAWA, MASASHI; KAWAKAMI, KENICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022483/0001 →
Assignment of Assignor's Interest
Mar 23, 2009
From: TASAKA, KAZUHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022481/0887 →
Assignment of Assignor's Interest
Mar 23, 2009
From: KUMAMOTO, TOORU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022481/0735 →
Assignment of Assignor's Interest
Mar 24, 2009
From: IMAGAWA, KAZUYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022490/0003 →
Assignment of Assignor's Interest
Mar 24, 2009
From: TERAYAMA, TOSHIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022490/0251 →
Assignment of Assignor's Interest
Mar 25, 2009
From: SHIN-E, HIROYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022489/0388 →
Assignment of Assignor's Interest
Mar 25, 2009
From: KIMURA, KENJI; SATO, MASANORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022489/0306 →
Assignment of Assignor's Interest
Mar 27, 2009
From: OIKAWA, TAKESHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022495/0518 →
Assignment of Assignor's Interest
Mar 30, 2009
From: TSUCHI, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022495/0500 →
Assignment of Assignor's Interest
Mar 31, 2009
From: HAMAJIMA, TOMOHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022495/0989 →
Assignment of Assignor's Interest
Apr 1, 2009
From: CHO, SHIEN
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022535/0388 →
Assignment of Assignor's Interest
Apr 1, 2009
From: GA, FUMIKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022535/0391 →
Assignment of Assignor's Interest
Apr 6, 2009
From: FUJINO, SATOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022534/0732 →
Assignment of Assignor's Interest
Apr 7, 2009
From: TAKAOKA, HIROMICHI; KUBOTA, YOSHITAKA; TSUDA, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022566/0379 →
Assignment of Assignor's Interest
Apr 8, 2009
From: ARAI, NORIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022578/0307 →
Assignment of Assignor's Interest
Apr 9, 2009
From: ISHIKAWA, KENICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022568/0320 →
Assignment of Assignor's Interest
Apr 9, 2009
From: TAKAHASHI, HIROYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022569/0655 →
Assignment of Assignor's Interest
Jun 15, 2009
From: TONOMURA, FUMIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022842/0583 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →