IP Library Granted Patent US 8,252,408
Granted Patent B2
US 8,252,408 · App. 12/437,940 · Granted Aug 28, 2012

Electronic device and method of manufacturing the electronic device

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Quick Facts
Patent No.
US 8,252,408
App. No.
12/437,940
Granted
Aug 28, 2012
Kind
B2
Abstract

An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.

Claims (14)

1. An electronic device, comprising:

an element which has an optically functional region having an optical function on one face;

a transparent layer which is located on said optically functional region, directly comes in contact with the one face, and is optically transparent and a resin layer; and

a sealing resin layer having an upper face and a lower face which seals said one face and sides of said transparent layer, does not coat an upper face of said transparent layer, and is mixed with filler that improves rigidity;

wherein the upper face of said transparent layer and an upper face of said sealing resin layer are exposed on a surface of said electronic device, and

wherein the upper face of said transparent layer is 10 μm to 60 μm above the upper face of said sealing resin layer.

2. The electronic device according to claim 1 ,

wherein said transparent layer includes acrylic group resin or epoxy group resin.

3. The electronic device according to claim 1 ,

wherein said transparent layer is film-shaped resin.

4. The electronic device according to claim 1 ,

wherein said transparent layer has a coefficient of elasticity which is equal to or more than 1 GPa and equal to or less than 6 GPa at 20° C., and equal to or more than 10 MPa and equal to or less than 3 GPa at 200° C.

5. The electronic device according to claim 1 ,

wherein said transparent layer has a height equal to or more than 0.05 mm.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0183 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2009
From: UCHIDA, KENJI; HIRASAWA, KOKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022658/0928 →