Electronic device and method of manufacturing the same

1 . An electronic device comprising:

a substrate;

an electro-conductive pattern provided over said substrate;

an electronic component mounted over said substrate, and electrically connected to said electro-conductive pattern;

a resin cap provided over said substrate, and composed of two or more resin layers hollow-sealing said electronic component; and

an adhesive layer bonding said resin cap with said electro-conductive pattern.

2 . The electronic device as claimed in claim 1 ,

wherein said adhesive layer is an inorganic layer containing aluminum oxide, or an organic layer containing alkyd resin.

3 . The electronic device as claimed in claim 1 ,

wherein said substrate has a through-hole extended therethrough in the thickness-wise direction,

said electro-conductive pattern is extended from the top surface of said substrate through said through-hole out onto the back surface, and

said resin cap comprises:

a first resin layer bonded to said electro-conductive pattern while placing said adhesive layer in between so as to hollow-seal said electronic component;

a second resin layer covering said first resin layer; and

a third resin layer covering said second resin layer.

4 . The electronic device as claimed in claim 3 ,

wherein said second resin layer covers an opening of said through-hole on the top surface side of said substrate.

5 . The electronic device as claimed in claim 3 ,

wherein said second resin layer is composed of a resin film.

6 . The electronic device as claimed in claim 1 ,

wherein said electronic component operates at high frequencies.

7 . The electronic device as claimed in claim 1 , obtained by singulation between every adjacent electronic components mounted on said substrate.

8 . A method of manufacturing an electronic device comprising:

preparing a substrate having an electro-conductive pattern formed thereon;

forming an adhesive layer over said electro-conductive pattern provided over said substrate;

mounting an electronic component over said substrate, and electrically connecting said electronic component with said electro-conductive pattern; and

bonding a resin cap composed of two or more resin layers with said electro-conductive pattern while placing said adhesive layer in between, so as to hollow-seal said electronic component.

9 . The method of manufacturing an electronic device as claimed in claim 8

wherein said forming said adhesive layer further comprises:

forming an adhesive layer composed of either an inorganic layer containing aluminum oxide, or an organic layer containing alkyd resin.

10 . The method of manufacturing an electronic device as claimed in claim 8 ,

wherein said preparing said substrate further comprises:

preparing a substrate having a plurality of through-holes extended therethrough in the thickness-wise direction, and having an electro-conductive pattern extended from the top surface thereof through said through-holes out onto the back surface thereof,

wherein said electrically connecting said electronic component with said electro-conductive pattern further comprises:

mounting a plurality of said electronic components onto regions of said substrate having no through-holes formed therein, and

said hollow-sealing said electronic component further comprises:

forming a first resin layer which bonds to said electro-conductive pattern while placing said adhesive layer in between, so as to hollow-seal said electronic component;

forming a second resin layer over said first resin layer; and

forming a third resin layer over said second resin layer.

11 . The method of manufacturing an electronic device as claimed in claim 10 ,

wherein said forming said second resin layer further comprises:

forming said second resin layer which covers said first resin layer, and covers also the opening of said through-hole over the top surface side of said substrate.

12 . The method of manufacturing an electronic device as claimed in claim 11 ,

wherein said forming said second resin layer further comprises:

covering the entire top surface of said substrate with said second resin layer composed of a resin film, and bonding said second resin layer with said substrate while pressurizing it towards the top surface of said substrate.

13 . The method of manufacturing an electronic device as claimed in claim 8 , further comprising, after said hollow-sealing said electronic components,

singulating the electronic device by dicing said substrate between every adjacent electronic components.