Electronic device substrate and its fabrication method, and electronic device and its fabrication method
View Patent ↗An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
1. An electronic device substrate, comprising:
a thin-plate core substrate comprising a metal film, a release layer, and a metal layer;
a metal electrode provided on the metal layer of the core substrate to be electrically connected to an electrode of an electronic component to be packaged thereon;
an electrical insulation layer provided on the metal layer to surround the metal electrode; and
wherein the metal film of the core substrate is laminated with a support substrate comprising an insulation film with an adhesive.
2. The electronic device substrate according to claim 1 , wherein the release layer is provided on the metal film and the metal layer is provided on the release layer.
3. The electronic device substrate according to claim 2 , wherein the release layer is provided directly onto the metal film and the metal layer is provided directly onto the release layer.
4. The electronic device substrate according to claim 1 , wherein the release layer contacts the metal film and the metal layer contacts the release layer.
5. The electronic device substrate according to claim 1 , wherein the core substrate contacts the metal electrode.
6. The electronic device substrate according to claim 1 , wherein the support substrate is configured to be separable from the metal layer together with the metal film by using the release layer,
wherein the metal layer, the release layer, the metal film, and the support substrate are formed, respectively in that order, from one side of the electrical insulation layer.
7. The electronic device substrate according to claim 1 , wherein the metal layer is laminated directly onto the release layer and the release layer is directly laminated onto the metal film in a direction extending from the metal electrode to the support substrate.