Semiconductor chip and semiconductor device, and method of manufacturing the same
View Patent ↗At least a part of an outer edge of a surface where a circuit forming region, for example, of a semiconductor substrate that forms a semiconductor chip is arranged (a region surrounded by a scribe line around the circuit forming region) is cut or polished, so as to form a smooth slope is chamfered non-parallel and non-vertical to the circuit forming region. Then, a code indicating management information is assigned to the slope. Further, a plurality of semiconductor chips are stacked to manufacture a semiconductor device.
1. A semiconductor chip comprising:
first and second principal surfaces that are opposed to each other; and
a slope that is non-parallel and non-vertical to the first principal surface, the slope being formed by chamfering at least a part of an outer edge of the first principal surface,
wherein a semiconductor circuit is formed on at least one of the first and second principal surfaces, and information is displayed on the slope.
2. A semiconductor device comprising:
a semiconductor chip including first and second principal surfaces that are opposed to each other, and a slope that is non-parallel and non-vertical to the first principal surface, the slope being formed by chamfering at least a part of an outer edge of the first principal surface; and
another semiconductor chip that is stacked on the first principal surface of the semiconductor chip,
wherein a semiconductor circuit is formed on at least one of the first and second principal surfaces, and information is displayed on the slope.
3. A method of manufacturing a semiconductor chip including first and second principal surfaces that are opposed to each other and a semiconductor circuit that is formed in at least one of the first and second principal surfaces, the method comprising:
chamfering at least a part of an outer edge of the first principal surface in a way that the part is non-parallel and non-vertical to the first principal surface; and
assigning information to the slope that is formed by the chamfering.
4. The method of manufacturing the semiconductor chip according to claim 3 , wherein at least the part of the outer edge is cut or polished to form the slope to be smooth in the chamfering.
5. A method of manufacturing a semiconductor device, comprising:
chamfering at least a part of an outer edge of a first principal surface of a semiconductor chip including first and second principal surfaces that are opposed to each other and a semiconductor circuit that is formed on at least one of the first and second principal surfaces in a way that the part is non-parallel and non-vertical to the first principal surface, and assigning information to a slope that is formed by the chamfering; and
stacking another semiconductor chip on the first principal surface of the semiconductor chip.