Patent Assignment
Reel/Frame 022568/0320
Assignment of Assignor's Interest
Recorded: 2009-04-09
Pages: 4
Assignor
ISHIKAWA, KENICHI
Executed: 2009-04-06
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Including Plurality of Bonding Pads
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.