IP Library Assignment 022330/0019
Patent Assignment
Reel/Frame 022330/0019

Assignment of Assignor's Interest

Recorded: 2009-03-02 Pages: 3
Assignors
MACKAY, JOHN
Executed: 2009-02-25
MOLINARO, TOM
Executed: 2009-02-25
Assignee
WSTP, LLC
940 CALLE AMANECER, SUITE K, SAN CLEMENTE, CALIFORNIA, 92673
Covered Property (1)
Forming Solder Balls on Substrates
Patent: 7,654,432 →
Application: 12/323,772 →
Publication: US 2009/0159641
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 31, 2017
From: WSTP, LLC
To: SEMIPAC, INC.
Reel/Frame 043144/0364 →