IP Library › Assignment 043144/0364
Patent Assignment
Reel/Frame 043144/0364

Assignment of Assignor's Interest

Recorded: 2017-07-31 Pages: 3
Assignor
WSTP, LLC
Executed: 2017-07-01
Assignee
SEMIPAC, INC.
1206F MOUNTAINVIEW-ALVISO RD., SUNNYVALE, CALIFORNIA, 94089
Covered Properties (11)
Captured-Cell Solder Printing and Reflow Methods
Patent: 5,988,487 →
Application: 08/863,800 →
Methods and Apparatuses for Forming Solder Balls on Substrates
Patent: 6,293,456 →
Application: 09/273,517 →
Ball Bumping Substrates, Particuarly Wafers
Patent: 6,609,652 →
Application: 09/962,007 →
Publication: US 2002/0084315
Bumping Electronic Components Using Transfer Substrates
Patent: 7,288,471 →
Application: 10/989,107 →
Publication: US 2005/0150936
Nanostructure and Nanocomposite Based Compositions and Photovoltaic Devices
Patent: 7,087,833 →
Application: 11/008,315 →
Publication: US 2005/0214967
Forming Solder Balls on Substrates
Patent: 7,604,153 →
Application: 11/370,500 →
Publication: US 2006/0208041
Bumping Electronic Components Using Transfer Substrates
Patent: 7,842,599 →
Application: 11/873,396 →
Publication: US 2008/0176393
Bumping Electronic Components Using Transfer Substrates
Patent: 7,819,301 →
Application: 11/925,493 →
Publication: US 2008/0087709
Forming Solder Balls on Substrates
Patent: 7,654,432 →
Application: 12/323,772 →
Publication: US 2009/0159641
Maskless Process for Solder Bumps Production
Application: 12/473,530 →
Publication: US 2009/0298277
Forming Solder Balls on Substrates
Patent: 7,837,083 →
Application: 12/639,782 →
Publication: US 2010/0089983
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 19, 1998
From: MACKAY, JOHN T.; MOLINARO, THOMAS E.; LOVE, DAVID G.; BOUCHER, PATRICIA R.
To: FUJITSU LIMITED; SEMI-PAC
Reel/Frame 009051/0940 →
Assignment of Assignor's Interest May 10, 1999
From: MACKAY, JOHN; MOLINARO, TOM
To: SPHERETEK, LLC.
Reel/Frame 009959/0471 →
Assignment of Assignor's Interest Jan 10, 2002
From: MACKAY AND MOLINARO
To: SPHERETEK, LLC
Reel/Frame 012470/0313 →
Assignment of Assignor's Interest Jun 13, 2008
From: SPHERETEK, LLC
To: WSTP, LLC
Reel/Frame 021096/0044 →
Assignment of Assignor's Interest Jun 13, 2008
From: SPHERETEK, LLC
To: WSTP, LLC
Reel/Frame 021094/0937 →
Assignment of Assignor's Interest Jun 13, 2008
From: SEMI-PAC, INC.
To: SPHERETEK, LLC
Reel/Frame 021096/0041 →
Assignment of Assignor's Interest Jun 13, 2008
From: SPHERETEK, LLC
To: WSTP, LLC
Reel/Frame 021127/0575 →
Assignment of Assignor's Interest Jun 13, 2008
From: MACKAY, JOHN
To: SPHERETEK, LLC
Reel/Frame 021127/0586 →
Assignment of Assignor's Interest Jun 13, 2008
From: SPHERETEK, LLC
To: WSTP, LLC
Reel/Frame 021127/0589 →
Assignment of Assignor's Interest Jun 13, 2008
From: SPHERETEK, LLC
To: WSTP, LLC
Reel/Frame 021127/0592 →
Assignment of Assignor's Interest Jun 13, 2008
From: MACKAY, JOHN
To: SPHERETEK, LLC
Reel/Frame 021131/0683 →
Assignment of Assignor's Interest Mar 2, 2009
From: MACKAY, JOHN; MOLINARO, TOM
To: WSTP, LLC
Reel/Frame 022330/0019 →
Assignment of Assignor's Interest Oct 21, 2009
From: MACKAY, JOHN; ROSKOS, HENRY
To: WSTP, LLC
Reel/Frame 023402/0337 →
Assignment of Assignor's Interest Dec 16, 2009
From: MACKAY, JOHN; MOLINARO, TOM
To: WSTP, LLC
Reel/Frame 023664/0696 →
Assignment of Assignor's Interest Mar 19, 2010
From: MACKAY, JOHN; MOLINARO, TOM
To: SPHERETEK, LLC
Reel/Frame 024107/0523 →
Assignment of Assignor's Interest Mar 19, 2010
From: SPHERETEK, LLC
To: WSTP, LLC
Reel/Frame 024107/0579 →
Assignment of Assignor's Interest Jun 29, 2010
From: MACKAY, JOHN
To: WSTP, LLC
Reel/Frame 024610/0805 →
Security Agreement Jul 30, 2010
From: NANOSYS, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 024767/0532 →