Granted Patent
Utility
US 6,293,456 · App. 09/273,517
Methods for forming solder balls on substrates
Inventors:
John MacKay, Tom Molinaro
Patented Case
View Patent ↗
Granted: Sep 25, 2001
Filed: Mar 22, 1999
Inventors
John MacKay
Tom Molinaro
Assignee (at issue)
Spheretek, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.