IP Library Assignment 023664/0696
Patent Assignment
Reel/Frame 023664/0696

Assignment of Assignor's Interest

Recorded: 2009-12-16 Pages: 3
Assignors
MACKAY, JOHN
Executed: 2009-02-25
MOLINARO, TOM
Executed: 2009-02-25
Assignee
WSTP, LLC
940 CALLE AMANECER, SUITE K, SAN CLEMENTE, CALIFORNIA, 92673
Covered Property (1)
Forming Solder Balls on Substrates
Patent: 7,837,083 →
Application: 12/639,782 →
Publication: US 2010/0089983
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 31, 2017
From: WSTP, LLC
To: SEMIPAC, INC.
Reel/Frame 043144/0364 →