IP Library › Assignment 021127/0575
Patent Assignment
Reel/Frame 021127/0575

Assignment of Assignor's Interest

Recorded: 2008-06-13 Pages: 3
Assignor
SPHERETEK, LLC
Executed: 2008-06-06
Assignee
WSTP, LLC
940 CALLE AMANECER, SUITE K, SAN CLEMENTE, CALIFORNIA, 92673
Covered Property (1)
Ball Bumping Substrates, Particuarly Wafers
Patent: 6,609,652 →
Application: 09/962,007 →
Publication: US 2002/0084315
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2002
From: MACKAY AND MOLINARO
To: SPHERETEK, LLC
Reel/Frame 012470/0313 →
Assignment of Assignor's Interest Jul 31, 2017
From: WSTP, LLC
To: SEMIPAC, INC.
Reel/Frame 043144/0364 →