IP Library › Assignment 022341/0518
Patent Assignment
Reel/Frame 022341/0518

Assignment of Assignor's Interest

Recorded: 2009-02-23 Pages: 4
Assignors
KAMEDA, KENJI
Executed: 2009-02-16
WANG, JIE
Executed: 2009-02-16
URANO, YUJI
Executed: 2009-02-16
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOAKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Method for manufacturing semiconductor device and substrate processing apparatus
Patent: 9,856,560 →
Application: 12/379,471 →
Publication: US 2009/0170328
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →