Patent Assignment
Reel/Frame 022350/0852
Assignment of Assignor's Interest
Recorded: 2009-03-05
Pages: 5
Assignors
YONEDA, SHUJI
Executed: 2009-01-28
OISHI, MASATO
Executed: 2009-02-10
SHINOHARA, TAMOTSU
Executed: 2009-02-02
WATANABE, SHINJI
Executed: 2009-02-03
MIYATA, KOJI
Executed: 2009-02-03
FUKAE, SEIJI
Executed: 2009-02-03
YAMAUCHI, KENJI
Executed: 2009-02-02
GOTO, YOICHI
Executed: 2009-02-10
BABA, MASAKAZU
Executed: 2009-02-05
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO 108-0075, JAPAN
Covered Property
(1)
Semiconductor Device with Groove Structure to Prevent Molding Resin Overflow Over a Light Receiving Region of a Photodiode During Manufacture and Method for Manufacturing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.