Patent Assignment
Reel/Frame 022356/0107
Assignment of Assignor's Interest
Recorded: 2009-03-06
Pages: 6
Assignors
MCCONNELEE, PAUL ALAN
Executed: 2009-03-02
DUROCHER, KEVIN M.
Executed: 2009-03-02
CUNNINGHAM, DONALD PAUL
Executed: 2009-03-03
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NEW YORK, 12345
Covered Property
(1)
System and Method for Stacked Die Embedded Chip Build-Up
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 071674/0420 →
Change of Name
Jun 23, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071692/0511 →
Assignment of Assignor's Interest
Jun 23, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071704/0816 →