IP Library › Assignment 022358/0934
Patent Assignment
Reel/Frame 022358/0934

Assignment of Partial Interest

Recorded: 2009-03-05 Pages: 3
Assignor
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO 108-0075, JAPAN
Covered Property (1)
Method for Manufacturing a Bump-Attached Wiring Circuit Board
Patent: 7,520,053 →
Application: 11/294,530 →
Publication: US 2006/0070978
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 17, 2006
From: SONY CHEMICALS CORPORATION
To: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 018550/0258 →