Patent Assignment
Reel/Frame 022363/0687
Assignment of Assignor's Interest
Recorded: 2009-03-03
Pages: 4
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
6-2, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Slicing Method and Method for Manufacturing Epitaxial Wafer