Patent Assignment
Reel/Frame 022372/0272
Assignment of Assignor's Interest
Recorded: 2009-03-10
Pages: 3
Assignors
SUH, DAEWOONG
Executed: 2008-04-28
HOULE, SABINA
Executed: 2008-04-28
ZARBOCK, EDWARD A.
Executed: 2008-04-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Thermal Interface Material for Combined Reflow