Patent Assignment
Reel/Frame 022381/0519
Assignment of Assignor's Interest
Recorded: 2009-02-27
Pages: 2
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board with Solder Bump on Solder Pad and Flow Preventiing Dam