Assignment of Assignor's Interest

Recorded: 2009-03-17 Received: 2009-03-17 Pages: 5

Assignors

CHOW, SENG GUAN

Executed: 2009-02-06

HAN, BYUNG JOON

Executed: 2009-02-06

SHIM, IL KWON

Executed: 2009-02-06

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE

Covered Properties (2)

Integrated Circuit Package-on-Package Stacking System and Method of Manufacture Thereof

Application: 12/371,730 →

Method of Creating Incentives for Establishing Hotspot Locations

Application: 10/315,145 →